SMTA International 2019 has ended

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SMTA International 2019

8:30am CDT

PDC01: Design, Fabrication and Assembly Process Principles for Flexible and Rigid Flex Circuits Room 53 PDC02: Principles and Practice of Developing Soldering Profiles Room 52 PDC03: Humidity Robustness of Electronics: How to Tackle? * CANCELLED* Room 51 PDC04: Cost Conscious Test Strategies for Electronic Products Room 50

1:30pm CDT

PDC05: Stencil Printing – Advanced Topics Room 51 PDC06: Achieving High Reliability for Lead-Free Solder Joints - Materials Consideration Room 50 PDC07: Embedding Passive and Active Components PCB Design, Fabrication Methodologies and Assembly Process Strategy *Cancelled!* Room 52 PDC08: Design and Assembly Process Challenges for Bottom Terminations Components (BTCs) such as QFN, DFN and MLF in Tin-Lead & Lead Free World Room 53

8:30am CDT

INS1:New Inspection Technologies Towards Industry 4.0 Room 48 HE1: Understanding PCBA Ionic Contamination and Corrosive Mitigation Practices for Increased Survivability in Corrosive Environments Room 47/49 PDC09: Solder Joint Reliability – Principles and Practice Room 51 PDC10: Solder Paste Qualification Using the SMTA Miniaturization Test Vehicle Room 53 PDC11: Printing in the Third Dimension; Design, Materials, Equipment & Applications in Electronics Room 50 PDC12: Defect Analysis and Process Troubleshooting: Part 1 Room 52

10:30am CDT

INS2: Inspection for Manufacturing Performance Improvement Room 48

11:00am CDT

Microvia Reliability Lab Room 45 HE2: Reliability Concerns for Automotive Applications Room 47/49

1:30pm CDT

HE3: Improving the Reliability of Lead-free Solder Joints Room 47/49 INS3: New Techniques to Combat Counterfeit Electronics Room 48 PDC13: Defect Analysis and Process Troubleshooting: Part 2 Room 52 PDC14: Design for Excellence: Manufacturing & Reliability Physics Room 50 PDC15: Tolerance Mistaken: Impacts of Not Properly Addressing Limitations of Material, Industry Standards and Assembly Process Limitations Room 53 Women's Leadership Program Room 34

3:30pm CDT

INS4: Inspection Methods for Long Term Assembly Reliability Room 48 HE4: Progress in Lead-free Solders for Harsh Environment Applications Room 47/49

5:00pm CDT

Women’s Leadership Connection Reception Room 34

8:00am CDT

Tuesday Keynote Session and SMTA Annual Meeting Room 21

10:00am CDT

Electronics Exhibition Expo Show Floor - Hall F

11:00am CDT

APT1: Advanced Packaging Room 48 FSA1: Low Melting Alloys Mixing with SAC Alloys Room 49 MFX1: Cleaning Technologies Room 44 SUB1: Surface Finishes Room 45

2:00pm CDT

APT2: Package Warpage Implications during Board Assembly Room 48 FSA2: Low Melting Alloy and Reliability Room 49 MFX2: Reflow Challenges Room 44 SUB2: Surface Finish Effects Room 45

7:00am CDT

Fun Run Double Tree Lobby

8:00am CDT

APT3: Solder Joint Voiding Room 48 FSA3: Flux Performances Room 49 MFX3: Stencils & Printing Room 44 SUB3: Reliability Room 45

10:00am CDT

Wednesday Keynote Session Room 21

11:00am CDT

APT4: Wafer Level Packaging Room 48 FSA4: Reliability Enhancement Through Bonding Room 49 MFX4: MFX Assembly Challenges Room 44 SUB4: Metallization Room 45

1:30pm CDT

APT5: Reliability I Room 48 MFX5: New and Unique Material Deposition Room 44 SUB5: How It is Made Room 45

3:00pm CDT

Meetings to Greetings Reception Expo Show Floor - Hall F

8:00am CDT

LF1: Lead-Free Reliability I Room 49 TI1: Smart Factory Room 45 APT6:Thermal Room 48 MFX6: Conformal Coating TBA

10:30am CDT

APT7: Reliablity II Room 48 MFX7: Cleaning Challenges Room 44 LF2: Microstructure, Structure, Properties Room 49 TI2: Digital Strategy for Electronics Manufacturing Room 45

1:00pm CDT

LF3:Low Temperature Solder Room 49 TI3: Additive Manufacturing in Electronics Panel Room 45

2:45pm CDT

LF4: Lead-Free Reliability II Room 49