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SMTA International 2019

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8:30am CDT

INS1:New Inspection Technologies Towards Industry 4.0 Room 48 HE1: Understanding PCBA Ionic Contamination and Corrosive Mitigation Practices for Increased Survivability in Corrosive Environments Room 47/49 PDC09: Solder Joint Reliability – Principles and Practice Room 51 PDC10: Solder Paste Qualification Using the SMTA Miniaturization Test Vehicle Room 53 PDC11: Printing in the Third Dimension; Design, Materials, Equipment & Applications in Electronics Room 50 PDC12: Defect Analysis and Process Troubleshooting: Part 1 Room 52

10:30am CDT

INS2: Inspection for Manufacturing Performance Improvement Room 48

11:00am CDT

Microvia Reliability Lab Room 45 HE2: Reliability Concerns for Automotive Applications Room 47/49

1:30pm CDT

HE3: Improving the Reliability of Lead-free Solder Joints Room 47/49 INS3: New Techniques to Combat Counterfeit Electronics Room 48 PDC13: Defect Analysis and Process Troubleshooting: Part 2 Room 52 PDC14: Design for Excellence: Manufacturing & Reliability Physics Room 50 PDC15: Tolerance Mistaken: Impacts of Not Properly Addressing Limitations of Material, Industry Standards and Assembly Process Limitations Room 53 Women's Leadership Program Room 34

3:30pm CDT

INS4: Inspection Methods for Long Term Assembly Reliability Room 48 HE4: Progress in Lead-free Solders for Harsh Environment Applications Room 47/49

5:00pm CDT

Women’s Leadership Connection Reception Room 34