SMTA International 2019

Chair:  *Raiyo Aspandiar, Ph.D., Intel Corproation
Co-Chair: Jagadeesh Radhakrishnan, Intel Corporation

>>Evaluation of Warpage Behavior of SMD-Packages and Boards During Soldering
Karsten Meier, Ph.D., Heinz Wohlrabe, Oliver Albrecht, Technische Universität Dresden; *Jörg Trodler, Dipl. -Ing,. Heraeus Electronics

>>Reliability of Electrical Devices due to Warpage Behavior of SMD-Packages and Boards during Soldering
*Jörg Trodler, Dipl. -Ing,. Heraeus Electronics; Karsten Meier, Ph.D., Heinz Wohlrabe, Oliver Albrecht, Technische Universität Dresden

>>High Temperature Component Warpage as a Function of Moisture Sensitivity (MSL) Rating
*Neil Hubble, Akrometrix LLC