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Tuesday, September 24 • 2:00pm - 3:30pm
APT2: Package Warpage Implications during Board Assembly

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Chair:  *Raiyo Aspandiar, Ph.D., Intel Corproation
Co-Chair: Jagadeesh Radhakrishnan, Intel Corporation

>>Evaluation of Warpage Behavior of SMD-Packages and Boards During Soldering
Karsten Meier, Ph.D., Heinz Wohlrabe, Oliver Albrecht, Technische Universität Dresden; *Jörg Trodler, Dipl. -Ing,. Heraeus Electronics

>>Reliability of Electrical Devices due to Warpage Behavior of SMD-Packages and Boards during Soldering
*Jörg Trodler, Dipl. -Ing,. Heraeus Electronics; Karsten Meier, Ph.D., Heinz Wohlrabe, Oliver Albrecht, Technische Universität Dresden

>>High Temperature Component Warpage as a Function of Moisture Sensitivity (MSL) Rating
*Neil Hubble, Akrometrix LLC

Tuesday September 24, 2019 2:00pm - 3:30pm CDT
Room 48

Attendees (9)