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Wednesday, September 25 • 8:00am - 10:00am
APT3: Solder Joint Voiding

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Chair: Andy Behr, Panasonic
Co-Chair: Michael Jansen, Raytheon Company

>>X-ray Micro-Computed Tomography Based FE Models to Capture Realistic Manufacturing Variability in Cu-Al Wirebonds and Solder-Joints in QFNs
*Pradeep Lall, Ph.D., Madhu Kasturi, Nakul Kothari, Auburn University; David Locker, US Army CCDC Aviation & Missile Center

>>Real Time X-Ray Analysis of Void Formation and Dynamics in QFN Devices During Reflow
Evstatin Krastev, Sandeep Kullar, Christopher Rand, Nordson Dage

>>Identifying Voids on BTC Assemblies with X-ray Analysis
*Bill Cardoso, Ph.D., Creative Electron, Inc.

>>New X-Ray Technologies for Enhanced Void Investigation
*Ragnar Vaga, YXLON International GmbH


Wednesday September 25, 2019 8:00am - 10:00am CDT
Room 48