Loading…
Back To Schedule
Wednesday, September 25 • 11:00am - 12:30pm
APT4: Wafer Level Packaging

Sign up or log in to save this to your schedule, view media, leave feedback and see who's attending!

Chair: *Charles Woychik, Ph.D., i3 Microsystems, Inc.
Co-Chair: *Jim Wilcox, Universal Instrument

>>Solder Joint Reliability of BGA Packages on High Frequency Laminate PCBs Under Power Cycling
Akshay Lakshminarayana, Mahesh Pallapothu, Mugdha Chaudhari, Unique Rahangdale, Abel Misrak, Dereje Agonafer, Ph.D., University of Texas Arlington

>>High Density RDL Technologies for Panel Level Packaging of Embedded Dies
*Lars Böttcher, S. Kosmider, R. Kahle and A. Ostmann Fraunhofer IZM Berlin; F. Schein, Technical University of Berlin

>>Multi-axis Loading Effect on Edgebond and Edgefilled WLCSP Thermal Cycling Performance
*Tae-Kyu Lee, Ph.D., Andy Hsiao, Portland State University; Edward Ibe, Karl Loh, Zymet

Wednesday September 25, 2019 11:00am - 12:30pm CDT
Room 48

Attendees (6)