Wednesday, September 25 • 1:30pm - 3:00pm
APT5: Reliability I

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Chair: *Roy Starks, Libra Industries
Co-Chair: *Reza Ghaffarian, Ph.D., NASA JPL

>>Effect of Cure Conditions on the Interface Properties and Reliability of Potted Electronics in 25,000g Mechanical Shock
*Pradeep Lall, Ph.D., Kalyan Dornala, Auburn University; Ryan Lowe, ARA Associates; John Deep, Air Force Research Laboratories

>>Solder Joint Integrity Evaluation of Bottom Terminated Component (BTC) Subjected to Thermal Cycling
Tim Pearson, Collins Aerospace

>>An Investigation on the Influence of Copper and Nickel Solderable Surfaces on Solder Joint Degradation due to Gold Embrittlement
Daphne Gates, Collins Aerospace

Wednesday September 25, 2019 1:30pm - 3:00pm CDT
Room 48