>>Effect of Cure Conditions on the Interface Properties and Reliability of Potted Electronics in 25,000g Mechanical Shock *Pradeep Lall, Ph.D., Kalyan Dornala, Auburn University; Ryan Lowe, ARA Associates; John Deep, Air Force Research Laboratories
>>Solder Joint Integrity Evaluation of Bottom Terminated Component (BTC) Subjected to Thermal Cycling Tim Pearson, Collins Aerospace
>>An Investigation on the Influence of Copper and Nickel Solderable Surfaces on Solder Joint Degradation due to Gold Embrittlement Daphne Gates, Collins Aerospace
Wednesday September 25, 2019 1:30pm - 3:00pm CDT
Room 48
