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Thursday, September 26 • 8:00am - 10:00am

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Chair: *Pradeep Lall, Ph.D., Auburn University
Co-Chair: *Marc Benowitz, iNEMI

>>High-reliability Lead-free Solder for Low-cost Die Attach Applications
*Ranjit Pandher, Ph.D., Niveditha Nagarajan, Sathish Kumar, Gyan Dutt, Carl Bilgrien, MacDermid Alpha Electronics Solution

>>Mechanical Failure of Thermal Interface Materials Due to Thermal Aging and Impact on Performance of Electronic Package
Tushar Chauhan, ASM Raufur Chowdhury, Abel Misrak, Rabin Bhandari, Pavan Rajmane, Krishna Bhavana Sivaraju, Milad Abdulhasansari, Dereje Agonafer, The University of Texas at Arlington

>>Modification and Application of Organic Phase Change Materials for Thermal Peak Management
*Mathias Nowottnick, Ph.D., Jacob Maxa, Andrej Novikov, University of Rostock

Thursday September 26, 2019 8:00am - 10:00am CDT
Room 48

Attendees (4)