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Thursday, September 26 • 10:30am - 12:00pm
APT7: Reliablity II

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Chair: *Brian Roggeman, Qualcomm Technologies Inc.
Co-Chair: Arvind Srinivasan Karthikeyan, Auburn University

>>Investigating BTC Design Parameters for Robust Electrochemical Reliability on a Printed Circuit Board
*Mark McMeen, *Mike Bixenman, MBA, DBA, Magnalytix, LLC

>>Reliability Assessment of BGA Solder Joints - Megtron 6 VS FR4 Printed Circuit Boards
ASM Raufur Chowdhury, The University of Texas at Arlington

>>Automotive Pb-Free BGA Packages Solder-Joint Reliability
*Burton Carpenter, *Andrew Mawer, Mollie Benson, John Arthur, Betty Yeung, NXP Semiconductors

Thursday September 26, 2019 10:30am - 12:00pm CDT
Room 48

Attendees (9)