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Tuesday, September 24 • 11:00am - 12:30pm
FSA1: Low Melting Alloys Mixing with SAC Alloys

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Chair: Kunal Desai, Kester
Co-Chair: Olivia Chen, Qualcomm Technologies Inc.

>>Properties of Mixing SAC Solder Alloys with Bismuth-Containing Solder Alloys for a Low Reflow Temperature Process
Tayler Swanson, Rochester Institute of Technology

>>Evaluations on the Mixing of the Tin-Bismuth Paste with SnAgCu BGA Components in Terms of Peak Temperature, Time Over Melting and Paste Volume
*Jasbir Bath, *Shantanu Joshi, Roberto Segura, Koki Solder America

>>Root Cause and Solution to Mitigate the Hot Tear Defect Mode in Hybrid SAC-Low Temp Solder Joints
Todd Harris, Kevin Byrd, Nilesh Badwe, Intel Corporation

Tuesday September 24, 2019 11:00am - 12:30pm CDT
Room 49