Chair: Kunal Desai, Kester Co-Chair: Olivia Chen, Qualcomm Technologies Inc.
>>Properties of Mixing SAC Solder Alloys with Bismuth-Containing Solder Alloys for a Low Reflow Temperature Process Tayler Swanson, Rochester Institute of Technology
>>Evaluations on the Mixing of the Tin-Bismuth Paste with SnAgCu BGA Components in Terms of Peak Temperature, Time Over Melting and Paste Volume *Jasbir Bath, *Shantanu Joshi, Roberto Segura, Koki Solder America
>>Root Cause and Solution to Mitigate the Hot Tear Defect Mode in Hybrid SAC-Low Temp Solder Joints Todd Harris, Kevin Byrd, Nilesh Badwe, Intel Corporation
Tuesday September 24, 2019 11:00am - 12:30pm CDT
Room 49
