>>Optimising Solder Alloy Composition for Low Temperature Assembly *Keith Sweatman, P.E., Tetsuro Nishimura, Tetsuya Akaiwa, Pavithiran Naraynanan, Nihon Superior Company, Ltd.
>>Gold (Au) Embrittlement of Plastic Quad Flat(pack) No-Lead (PQFN) Solder Joints and Mitigation Strategies *Paul Vianco, Ph.D., T. Garcia, C.E. Jaramillo, B.M. McKenzie, and J. Reese, Sandia National Laboratories
>>New High Reliability Lead Free Solder Alloy for Electronic Application in Extreme Environment Shawn Xiang, Md Hasnine, Ph.D., Xiang Wei, Ph.D., Kester Inc, An ITW Company
Tuesday September 24, 2019 2:00pm - 3:30pm CDT
Room 49