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Tuesday, September 24 • 2:00pm - 3:30pm
FSA2: Low Melting Alloy and Reliability

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Chair: Mike Buetow, Circuits Assembly
Co-Chair: Nilesh Badwe, Ph.D., Intel Corporation

>>Optimising Solder Alloy Composition for Low Temperature Assembly
*Keith Sweatman, P.E., Tetsuro Nishimura, Tetsuya Akaiwa, Pavithiran Naraynanan, Nihon Superior Company, Ltd.

>>Gold (Au) Embrittlement of Plastic Quad Flat(pack) No-Lead (PQFN) Solder Joints and Mitigation Strategies
*Paul Vianco, Ph.D., T. Garcia, C.E. Jaramillo, B.M. McKenzie, and J. Reese, Sandia National Laboratories

>>New High Reliability Lead Free Solder Alloy for Electronic Application in Extreme Environment
Shawn Xiang, Md Hasnine, Ph.D., Xiang Wei, Ph.D., Kester Inc, An ITW Company

Tuesday September 24, 2019 2:00pm - 3:30pm CDT
Room 49