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Wednesday, September 25 • 11:00am - 12:30pm
FSA4: Reliability Enhancement Through Bonding

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Chair: Chad Showalter, Humiseal
Co-Chair:*Dock Brown, ANSYS

>>NImproved IC Package Reliability via Epoxy Flux Reinforcement
Shigeru Yamatsu, Atsushi Yamaguchi, Andy Behr, Koso Matsuno, Yasuhiro Suzuki, Panasonic Corporation

>>Novel Application Methods of Solder Joint Encapsulant Materials for SnAgCu FCBGA Solder Joints
Alex Huettis, Barath Palanisamy, and Raiyo Aspandiar, Ph.D., Intel Corporation

>>Synthesis and Properties of Several Functional Dimeric Epoxy Resins Containing Naphthalene Units
Mark Edwards, Kunihiro Morinaga, Koji Hayashi, Yoshiyuki Takahashi, Sun Chemical

Wednesday September 25, 2019 11:00am - 12:30pm CDT
Room 49