Chair: Chad Showalter, Humiseal Co-Chair:*Dock Brown, ANSYS
>>NImproved IC Package Reliability via Epoxy Flux Reinforcement Shigeru Yamatsu, Atsushi Yamaguchi, Andy Behr, Koso Matsuno, Yasuhiro Suzuki, Panasonic Corporation
>>Novel Application Methods of Solder Joint Encapsulant Materials for SnAgCu FCBGA Solder Joints Alex Huettis, Barath Palanisamy, and Raiyo Aspandiar, Ph.D., Intel Corporation
>>Synthesis and Properties of Several Functional Dimeric Epoxy Resins Containing Naphthalene Units Mark Edwards, Kunihiro Morinaga, Koji Hayashi, Yoshiyuki Takahashi, Sun Chemical
Wednesday September 25, 2019 11:00am - 12:30pm CDT
Room 49
