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Tuesday, September 24 • 2:00pm - 3:30pm
MFX2: Reflow Challenges

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Co-Chair:*Chrys Shea, Shea Engineering Services

>>Vacuum Reflow Processing of Ball Grid Array Packages for Reduced Solder Joint Voiding and Improved Attachment Reliability
*Richard Coyle, Ph.D., Charmaine Johnson, Richard Popowich, Nokia Bell Labs; Tim Pearson, Dave Hillman, Collins Aerospace; Michael Meilunas, Universal Instruments; Fred Dimock, Bob Bouchard, BTU International; Richard Parker, iNEMI; Keith Howell, Nihon Superior Co., Ltd.; *Jörg Trodler, Dipl. -Ing,. Heraeus Electronics; Arvind Karthikeyan, Auburn University; Elizabeth Barr, Iowa State University

>>Effect of Vacuum Reflow on Solder Joint Voiding in Bumped Components
Arvind Srinivasan Karthikeyan, *Sa’d Hamasha, Ph.D., Auburn University; Michael Meilunas, Universal Instruments Corporation; Fred Dimock, BTU International, Inc.

Tuesday September 24, 2019 2:00pm - 3:30pm CDT
Room 44