SMTA International 2019

Chair:
Co-Chair:*Chrys Shea, Shea Engineering Services

>>Vacuum Reflow Processing of Ball Grid Array Packages for Reduced Solder Joint Voiding and Improved Attachment Reliability
*Richard Coyle, Ph.D., Charmaine Johnson, Richard Popowich, Nokia Bell Labs; Tim Pearson, Dave Hillman, Collins Aerospace; Michael Meilunas, Universal Instruments; Fred Dimock, Bob Bouchard, BTU International; Richard Parker, iNEMI; Keith Howell, Nihon Superior Co., Ltd.; *Jörg Trodler, Dipl. -Ing,. Heraeus Electronics; Arvind Karthikeyan, Auburn University; Elizabeth Barr, Iowa State University

>>Effect of Vacuum Reflow on Solder Joint Voiding in Bumped Components
Arvind Srinivasan Karthikeyan, *Sa’d Hamasha, Ph.D., Auburn University; Michael Meilunas, Universal Instruments Corporation; Fred Dimock, BTU International, Inc.