Chair: *Bill Capen, Honeywell Co-Chair: Adam Murling, Indium Corporation
>>Comparison of Aperture Designs, Solder Pastes, Nanocoatings and Print/Inspection Systems *Chrys Shea, Jennifer Fijalkowski, Shea Engineering Services; Raymond Whittier, BAE Systems; Michael Butler, Edward Nauss, ITWEAE/MPM; Dean Fiato, StenTech
>>Root Cause Stencil Design for SMT Component Thermal Lands *Greg Smith, BlueRing Stencils; *Tony Lentz, FCT Assembly
>>Robustness of High Tension, Standard Tension and Mesh Mount Solder Paste Stencils Prithvi Kotian, Plexus Corp.; Jeff Schake, ASM SMT Solutions; *Martin Anselm, Ph.D., Rochester Institute of Technology
>>Stencil Printing 008004/0201 Aperture Components Edward Nauss, Michael Butler, ITW EAE
Wednesday September 25, 2019 8:00am - 10:00am CDT
Room 44