SMTA International 2019

Chair: *Bill Capen, Honeywell
Co-Chair: Adam Murling, Indium Corporation

>>Comparison of Aperture Designs, Solder Pastes, Nanocoatings and Print/Inspection Systems
*Chrys Shea, Jennifer Fijalkowski, Shea Engineering Services; Raymond Whittier, BAE Systems; Michael Butler, Edward Nauss, ITWEAE/MPM; Dean Fiato, StenTech

>>Root Cause Stencil Design for SMT Component Thermal Lands
*Greg Smith, BlueRing Stencils; *Tony Lentz, FCT Assembly

>>Robustness of High Tension, Standard Tension and Mesh Mount Solder Paste Stencils
Prithvi Kotian, Plexus Corp.; Jeff Schake, ASM SMT Solutions; *Martin Anselm, Ph.D., Rochester Institute of Technology

>>Stencil Printing 008004/0201 Aperture Components
Edward Nauss, Michael Butler, ITW EAE