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Wednesday, September 25 • 8:00am - 10:00am
MFX3: Stencils & Printing

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Chair: *Bill Capen, Honeywell
Co-Chair: Adam Murling, Indium Corporation

>>Comparison of Aperture Designs, Solder Pastes, Nanocoatings and Print/Inspection Systems
*Chrys Shea, Jennifer Fijalkowski, Shea Engineering Services; Raymond Whittier, BAE Systems; Michael Butler, Edward Nauss, ITWEAE/MPM; Dean Fiato, StenTech

>>Root Cause Stencil Design for SMT Component Thermal Lands
*Greg Smith, BlueRing Stencils; *Tony Lentz, FCT Assembly

>>Robustness of High Tension, Standard Tension and Mesh Mount Solder Paste Stencils
Prithvi Kotian, Plexus Corp.; Jeff Schake, ASM SMT Solutions; *Martin Anselm, Ph.D., Rochester Institute of Technology

>>Stencil Printing 008004/0201 Aperture Components
Edward Nauss, Michael Butler, ITW EAE

Wednesday September 25, 2019 8:00am - 10:00am CDT
Room 44