Chair: *Chrys Shea, Shea Engineering Services Co-Chair:*Ray Whittier, BAE Systems
>>Low Temperature Solder Paste Transfer Efficiency Characterization and Area Ratio Limits Nilesh Badwe, Ph.D., Abhishek Prasad, Ph.D., Xiying Chen, and Kevin J Byrd, Intel Corporation
>>An Investigation Into the Development of Effective Printing Process for Package on Package (POP) Warpage and Head in Pillow Defect Reduction Narayanan Manickam, MS, SMTC Corporation
>>Selective Solder Fine Pitch Components on High Thermal Mass Assembly *Gerjan Diepstraten, Ing., Vitronics Soltec BV
Wednesday September 25, 2019 11:00am - 12:30pm CDT
Room 44
