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Wednesday, September 25 • 11:00am - 12:30pm
MFX4: MFX Assembly Challenges

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Chair: *Chrys Shea, Shea Engineering Services
Co-Chair:*Ray Whittier, BAE Systems

>>Low Temperature Solder Paste Transfer Efficiency Characterization and Area Ratio Limits
Nilesh Badwe, Ph.D., Abhishek Prasad, Ph.D., Xiying Chen, and Kevin J Byrd, Intel Corporation

>>An Investigation Into the Development of Effective Printing Process for Package on Package (POP) Warpage and Head in Pillow Defect Reduction
Narayanan Manickam, MS, SMTC Corporation

>>Selective Solder Fine Pitch Components on High Thermal Mass Assembly
*Gerjan Diepstraten, Ing., Vitronics Soltec BV

Wednesday September 25, 2019 11:00am - 12:30pm CDT
Room 44