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Wednesday, September 25 • 1:30pm - 3:00pm
MFX5: New and Unique Material Deposition

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Chair: *Martin Anselm, Ph.D., Rochester Institute of Technology (RIT)
Co-Chair:*Srinivas Chada, Ph.D., Stryker

>>High Density Micro-Dispensing Solder and Adhesives onto FHE and 3D Substrate Assemblies
Sam LeBlanc, nScrypt, Inc.

>>Ultra-Fine Solder Paste Dispensing for Heterogeneous Integration
Kenneth Thum, P.E., Sze Pei Lim, Indium Corporation; KC Tai, NSW Automation Sdn Bhd

>>Aerosol Jet Direct Writing Polymer-Thick-Film Resistors for Printed Electronics
James Feng, Ph.D., Anthony Loveland, Michael J. Renn, Optomec

Wednesday September 25, 2019 1:30pm - 3:00pm CDT
Room 44

Attendees (4)