SMTA International 2019

Chair: *Martin Anselm, Ph.D., Rochester Institute of Technology (RIT)
Co-Chair:*Srinivas Chada, Ph.D., Stryker

>>High Density Micro-Dispensing Solder and Adhesives onto FHE and 3D Substrate Assemblies
Sam LeBlanc, nScrypt, Inc.

>>Ultra-Fine Solder Paste Dispensing for Heterogeneous Integration
Kenneth Thum, P.E., Sze Pei Lim, Indium Corporation; KC Tai, NSW Automation Sdn Bhd

>>Aerosol Jet Direct Writing Polymer-Thick-Film Resistors for Printed Electronics
James Feng, Ph.D., Anthony Loveland, Michael J. Renn, Optomec