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Wednesday, September 25 • 8:00am - 10:00am
SUB3: Reliability

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Chair: *Lars Böttcher, Fraunhofer IZM Berlin
Co-Chair: *Jörg Trodler, Dipl. -Ing,. Heraeus Electronics

>>Transient Solder Separation of BGA Solder Joint During Second Reflow Cycle Phase III – The Impact of Back Drill
Steven Perng, Ph.D., Weidong Xie, Cisco Systems, Inc.

>>Impact of Oil Immersion on Thermo-mechanical Properties of PCB’s, its layers and Reliability of BGA Packages
Shrinath Ramdas, A S M Raufur R Chowdhury, Akshay Lakshminarayana, Rabin Bhandari, Tushar Chauhan, Abel Misrak, Dereje Agonafer, Ph.D., The University of Texas at Arlington

>>Improved Printed Circuit Board Reliability Through Quantitative Control of Cleaning Processes
Elizabeth Kidd, Brooke Campbell, R. Giles Dillingham, Ph.D., BTG Labs

Wednesday September 25, 2019 8:00am - 10:00am CDT
Room 45