>>Transient Solder Separation of BGA Solder Joint During Second Reflow Cycle Phase III – The Impact of Back Drill Steven Perng, Ph.D., Weidong Xie, Cisco Systems, Inc.
>>Impact of Oil Immersion on Thermo-mechanical Properties of PCB’s, its layers and Reliability of BGA Packages Shrinath Ramdas, A S M Raufur R Chowdhury, Akshay Lakshminarayana, Rabin Bhandari, Tushar Chauhan, Abel Misrak, Dereje Agonafer, Ph.D., The University of Texas at Arlington
>>Improved Printed Circuit Board Reliability Through Quantitative Control of Cleaning Processes Elizabeth Kidd, Brooke Campbell, R. Giles Dillingham, Ph.D., BTG Labs
Wednesday September 25, 2019 8:00am - 10:00am CDT
Room 45