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Wednesday, September 25 • 11:00am - 12:30pm
SUB4: Metallization

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Chair: *Julie Silk, Keysight Technologies
Co-Chair: *Jasbir Bath, Koki Solder America

>>Periodic Pulse Plating of Mid-Aspect Ratio Printed Circuit Boards for Enhanced Productivity
Carmichael Gugliotti, Rich Bellemare, Andy Oh, Ron Blake, MacDermid Alpha Electronics Solution

>>New developed Copper Electroplating Process for BMV Filling with the Special Feature of a Very Bright Cu Deposition on Flex and Flex-Rigid PCB Applications
John Foley, Mustaf Özkök, Dipl. -Ing., Peter Haack, Ph.D., Vera Peldinski, Dipl.-Ing., Thomas Huelsmann Dipl-Ing., Ph.D., Grigory Vazhenin, Ph.D., Henning Hübner, Dipl.-Ing., Atotech Deutschland GmbH

>>Evaluation of Direct Metallization Technology Plating Properties with Excellent Material Selectivity
Takuya Komeda, P.E., Tetsuji Ishida, Hisamitsu Yamamoto, C. Uyemura & Co., Ltd.

Wednesday September 25, 2019 11:00am - 12:30pm CDT
Room 45

Attendees (5)