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Monday, September 23 • 11:00am - 12:30pm
HE2: Reliability Concerns for Automotive Applications

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Chair: *Babak Arfaei, Ph.D., Ford Motor Company
Co-Chair: *Keith Sweatman, Nihon Superior Company, Ltd.

>>Solder-joint Reliability of a 0.65mm Pitch Molded Array Package for Automotive Applications
*Burton Carpenter, Mollie Benson, A. R. Nazmus Sakib, *Andrew Mawer, Paul Galles, Abdullah Fahim, NXP Semiconductors

>>Challenges of Automotive Electronics Miniaturization
*Maurice Dore, Valeo

>> Automotive Harsh Environments and Implications for ADAS and AD Sensors
*Dwight Howard, APTIV

Monday September 23, 2019 11:00am - 12:30pm CDT
Room 47/49