Back To Schedule
Monday, September 23 • 11:00am - 12:30pm
HE2: Reliability Concerns for Automotive Applications

Sign up or log in to save this to your schedule, view media, leave feedback and see who's attending!

Chair: *Babak Arfaei, Ph.D., Ford Motor Company
Co-Chair: *Keith Sweatman, Nihon Superior Company, Ltd.

>>Solder-joint Reliability of a 0.65mm Pitch Molded Array Package for Automotive Applications
*Burton Carpenter, Mollie Benson, A. R. Nazmus Sakib, *Andrew Mawer, Paul Galles, Abdullah Fahim, NXP Semiconductors

>>Challenges of Automotive Electronics Miniaturization
*Maurice Dore, Valeo

>> Automotive Harsh Environments and Implications for ADAS and AD Sensors
*Dwight Howard, APTIV

Monday September 23, 2019 11:00am - 12:30pm CDT
Room 47/49