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Monday, September 23 • 1:30pm - 3:00pm
HE3: Improving the Reliability of Lead-free Solder Joints

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Chair: *Robert Kinyanjui, Ph.D., John Deere Electronic Solutions, Inc.
Co-Chair: *André Delhaise, Ph.D., Celestica, Inc.

>>Analysis of the Root Cause for Solder Joint Cracking
Chaohui Hu, Weiming Li, P.E., Jianghua Shen, P.E., China CEPREI Laboratory

>>Qualification of High Density Connector Solutions for Military and Avionic Environments
Kimera Cho, Tim Pearson, David Hillman, Ross Wilcoxon, Collins Aerospace

>> Effect of Creep and Fatigue on Individual SAC305 Solder Joint Reliability in Iso-thermal Cycling
Mohammed Abueed, Ph.D., Raed Alathamneh, Sa’d Hamasha, Ph.D., Jeff Suhling, Ph.D., Pradeep Lall, Ph.D., Auburn University

Monday September 23, 2019 1:30pm - 3:00pm CDT
Room 47/49