Chair: *Robert Kinyanjui, Ph.D., John Deere Electronic Solutions, Inc. Co-Chair: *André Delhaise, Ph.D., Celestica, Inc.
>>Analysis of the Root Cause for Solder Joint Cracking Chaohui Hu, Weiming Li, P.E., Jianghua Shen, P.E., China CEPREI Laboratory
>>Qualification of High Density Connector Solutions for Military and Avionic Environments Kimera Cho, Tim Pearson, David Hillman, Ross Wilcoxon, Collins Aerospace
>> Effect of Creep and Fatigue on Individual SAC305 Solder Joint Reliability in Iso-thermal Cycling Mohammed Abueed, Ph.D., Raed Alathamneh, Sa’d Hamasha, Ph.D., Jeff Suhling, Ph.D., Pradeep Lall, Ph.D., Auburn University
Monday September 23, 2019 1:30pm - 3:00pm CDT
Room 47/49
