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Monday, September 23 • 3:30pm - 5:30pm
HE4: Progress in Lead-free Solders for Harsh Environment Applications

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Chair: *Babak Arfaei, Ph.D., Ford Motor Company
Co-Chair: *Burton Carpenter, Ph.D., NXP Semiconductors

>>Thermal Cycling Reliability of Newly Developed Lead-Free Solders for Harsh Environments
*Sa'd Hamasha, Ph.D., Francy John Akkara, Cong Zhao, Sudan Ahmed, Mohammed Abueed, Sinan Su, Jeffrey Suhling, *Pradeep Lall, Ph.D., Auburn University

>>Evaluation of Tin Whisker Formation on SOT and Discrete Components Assembled with Bismuth-Containing Lead-Free Solder Alloys after High Temperature, High Humidity Storage
*André Delhaise, Ph.D., Celestica, Inc.

>>Influence of a New Abnormal (CuNi)6Sn5 / (NiCu)3Sn4 Layer Growth at Temperatures Above 175°C in
Tin Silver Based Lead-Free Solder Joints
Timo Herberholz, , Robert Bosch GmbH; Andrey Prihodovsky, Ph.D., Deggendorf Institute of Technology; *Mathias Nowottnick, Ph.D., University of Rostock

>>Development of Low Temperature Sn-Bi Based Pb-Free Solder Alloys
*Mehran Maalekian, Ph.D., Aranav Das, Ludo Krassenburg, Co van Veen, Ph.D., Alexander Kodentsov, Ph.D., Mo Biglari, Ph.D., Mat- Tech

Monday September 23, 2019 3:30pm - 5:30pm CDT
Room 47/49