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Thursday, September 26 • 8:00am - 9:00am
LF1: Lead-Free Reliability I

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Chair:  *Andre Delhaise, Celestica
Co-Chair: *Lars Bruno M.Sc., Ericsson AB

>>Thermal Cycling Reliability and Failure Mode of Two Ball Grid Array Packages with High Reliability Pb-Free Solder Alloys
*Richard Coyle, Ph.D., Nokia Bell Labs

>>Attachment Quality and Thermal Fatigue Reliability of a Surface Mount Chip Resistor Assembled with a Low Temperature Solder
Charmaine Johnson, *Richard Coyle, Ph.D., Richard Popowich, Chen Xu, Nokia Bell Labs; *Martin Anselm, Ph.D., Ajitesh Singh Parihar, Tayler Swanson, Rochester Institute of Technology; *Lenora Clark, *Jason Fullerton, MacDermid Alpha Electronic Solutions

>>Bottom Terminated Component (BTC) Void Concerns: Real and Imagine
*David Hillman, Ross Wilcoxon, Tim Pearson, Kim Cho, Collins Aerospace

>>Status of Pb-free Risk Mitigation for Aerospace and Defense – “An Attitude Adjustment” Perspective
*Anthony Rafanelli, Ph.D., P.E., Raytheon Company

Thursday September 26, 2019 8:00am - 9:00am CDT
Room 49