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Thursday, September 26 • 1:00pm - 2:30pm
LF3:Low Temperature Solder

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Chair: *Srinivas Chada, Ph.D., Stryker
Co-Chair: *Julie Silk, Keysight Technologies

>>Tin-Bismuth Low Temperature Homogeneous Second Level Interconnect Solder Joint Microstructure, Reliability, and Failure Mechanism
Nilesh Badwe, Ph.D., Kevin Byrd, Ou Jin, Pubudu Goonetilleke, Intel Corporation

>>iNEMI Project on Process Development of Bisn-based Low Temperature Solder Pastes - Part Vi: Mechanical Shock Results on Resin Reinforced Mixed Snagcu-bisn Solder Joints of Fcbga Components
Jagadeesh Radhakrishnan, Intel Corporation; et al.

>>High Reliability Low Temperature Solder Alloys
*Anna Lifton, Pritha Choudhury, Ph.D., *Morgana Ribas, Ph.D., Raghu Raj Rangaraju, Siuli Sarkar, Ph.D., MacDermid Alpha Electronics Solutions

Thursday September 26, 2019 1:00pm - 2:30pm CDT
Room 49