>>Tin-Bismuth Low Temperature Homogeneous Second Level Interconnect Solder Joint Microstructure, Reliability, and Failure Mechanism Nilesh Badwe, Ph.D., Kevin Byrd, Ou Jin, Pubudu Goonetilleke, Intel Corporation
>>iNEMI Project on Process Development of Bisn-based Low Temperature Solder Pastes - Part Vi: Mechanical Shock Results on Resin Reinforced Mixed Snagcu-bisn Solder Joints of Fcbga Components Jagadeesh Radhakrishnan, Intel Corporation; et al.
