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Thursday, September 26 • 2:45pm - 3:00pm
LF4: Lead-Free Reliability II

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Chair: Rebecca Wheeling, Ph.D., Sandia National Laboratories      
Co-Chair: Charmaine Johnson, Nokia Bell Labs

>>Assessment of the Behavior of High Reliability Solder Alloys in Accelerated Thermal Testing
*Jim Wilcox, Universal Instruments

>>Study Electromigration in SnBiAg / SAC(305) Mixed Solder Alloy
Faramarz Hadian, Binghamton University

>>Reliability of the Solder Joints: Is a Shear Force a Good Indicator
*Anna Lifton, Westin Bent, Irina Lazovskaya, Paul Salerno, Frank Andres,MacDermid Alpha Electronics Solutions

Thursday September 26, 2019 2:45pm - 3:00pm CDT
Room 49