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Thursday, September 26 • 1:00pm - 2:30pm
TI3: Additive Manufacturing in Electronics Panel

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Chair: *Gary Tanel, Libra Industries
Co-Chair: *Jason Fullerton, MacDermid Alpha Assembly Solutions
Moderator: *Trevor Galbraith, Global SMT & Packaging

Panelists:
Daniel Braga, Accucode 3-D
*Pradeep Lall, Ph.D., Auburn University
Ofer Maltiel, Nano-Di
Kevin Smith, MarkForged
Thursday September 26, 2019 1:00pm - 2:30pm CDT
Room 45
  Technical Innovations Symposium, Ti Track

Attendees (6)