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Sunday, September 22 • 8:30am - 9:30am
PDC01: Design, Fabrication and Assembly Process Principles for Flexible and Rigid Flex Circuits

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PDC01: Design and Assembly Process Principles for High Density Flexible and Rigid Flex Circuits

Vern Solberg, Solberg Technical Consulting
Sunday, September 22 | 8:30am — 12:00pm

Course Objectives
Both uncased active and passive component elements are candidates for embedding but the process of selecting these components must be made early in the design process. Developers have realized that in addition to passive components, embedding one or more active die elements on an inner layer of the circuit in close proximity to pre-packaged semiconductor(s) mounted on the outer surface, electrical interface between components can be minimized, considerably improving functional performance. This closer coupling of key passive and active semiconductor elements will:
• Significantly reduce inductance • Contribute to increasing signal speed • Lower overall power consumption

Some components are easy candidates for integrating into the substrate while others may involve more complex processes and will be difficult to rationalize. And although a majority of the discrete passive and active devices may remain mounted on the outer surfaces of the circuit board, embedding a majority of the resistor functions and one or more silicon-based semiconductor elements within the inner layers of the structure can enable greater utilization of the circuit boards outer surfaces. This half-day course furnishes a comprehensive introduction to IPC-7092, Design and Assembly Process Implementation for Embedded Components.

The material presented has been developed to better enable the product designer and manufacturing specialist to have a clear understanding of the principles for embedding components in an organic multilayer circuit board structure. The course will include design guidelines, material selection and termination methodology for embedding both ‘active and passive components including formed and placed resistor, capacitor and inductor elements. Process variations for embedding and interconnecting thinned semiconductor elements within the multi-layer PCB will be illustrated with examples of both core type and coreless substrate structures.

Topics Covered:
1. Industry drivers for embedded component technology
2. Economic benefits for embedding components • Comparing passive component variations
3. Formed passive component methodology
4. Discrete passive component selection criteria
5. Addressing key factors in planning for ECP
6. Preparation for embedding semiconductors
7. Issues and concerns related to component supply chain
8. Core and coreless embedded component structures
9. Base material selection for the ECP application
10. Embedded component substrate development
11. Land pattern and circuit routing recommendations
12. Component attachment processes
13. Embedded component assembly variations
14. Semiconductor interface variations
15. Qualifying embedded component PCB fabricators

Sunday September 22, 2019 8:30am - 9:30am CDT
Room 53

Attendees (4)