Back To Schedule
Sunday, September 22 • 1:30pm - 5:00pm
PDC06: Achieving High Reliability for Lead-Free Solder Joints - Materials Consideration

Sign up or log in to save this to your schedule, view media, leave feedback and see who's attending!

PDC06: Achieving High Reliability for Lead-Free Solder Joints - Materials Consideration

*Ning-Cheng Lee, Ph.D., Indium Corporation
Sunday, September 22 | 1:30pm — 5:00pm

Course Objectives
This course covers the detailed material considerations required for achieving high reliability for lead-free solder joints. The reliability discussed includes joint mechanical properties, development of type and extent of intermetallic compounds (IMC) under a variety of material combinations and aging conditions and how those IMCs affect the reliability. The failure modes, thermal cycling reliability, and fragility of solder joints as a function of material combination, thermal history, and stress history will be addressed in details, and novel alloys with high reliability and reduced fragility will be presented. Electromigration and tin whisker will also be discussed. The emphasis of this course is placed on the understanding of how the various factors contributing to the failure modes, and how to select proper solder alloys and surface finishes for achieving high reliability.

Topics Covered
1. Prevailing Materials
1.1. Prevailing Solder Alloys
1.2. Prevailing Surface Finishes
2. Surface Finishes Issues
2.1. Issues of ENIG
2.2. Issues of ImAg
3. Mechanical Properties
3.1. Shear & Pull Strength
3.2. Creep
4. Intermetallic Compounds
4.1. Interaction of Cu and Ni
4.2. Effect of Cu Content in SAC
4.3. Effect of Alloy Additives
4.4. Effect of Phase Transition on Intrinsic IMC Cracking
5. Failure Modes
5.1. Grain Boundary Sliding & Cavitation
5.2. Grain Coarsening
5.3. Grain Orientation
5.4. Lead Contamination
5.5. Mixed Alloys
5.6. Effect of Cu Pad Grain Size

Sunday September 22, 2019 1:30pm - 5:00pm CDT
Room 50