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Tuesday, September 24 • 8:00am - 10:00am
Tuesday Keynote Session and SMTA Annual Meeting

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Tuesday, September 24 | 8:00am

FREE to All Attendees!

The Right Kind of Crazy: A True Story of Teamwork, Leadership and High Stakes Innovation
With a rich and varied background, Adam Steltzner had many of the needed skills to lead the landing team for the Curiosity rover. That said, his team would struggle for almost a decade with design challenges and set backs. How did he keep the team focused and on task? What makes a team gel and enables truly innovative thinking? How do team dynamics drive that process forward or inhibit it? And how can organizational culture create an environment for sustained performance? The challenges he and the team faced and the lessons learned from those struggles can help audiences understand how to better lead their high performing teams, manage innovation and drive towards excellence.

Adam Steltzner, Team Leader & Chief Engineer EDL, NASA Mars Rover Curiosity & Author
A history-making Ph.D. rocket scientist, Adam Steltzner is recognized as one of NASA’s leading – and most unique – innovators. For nearly a decade, Adam led and inspired the breakthrough team that invented the ingenious “sky crane” landing system that so spectacularly landed the Mars rover, Curiosity on the Martian surface 300,000,000 miles from Earth in 2012. Next, Adam will lead NASA’s Mars 2020 Project that will gather core samples of Mars for scientific discovery.

Congratulations to the 2018 SMTA International Conference Award Winners
>>Rich Freiberger Best of Conference Presentation
The Role of Nickel in Solder Alloys - Part 2. The Effect of Ni on The Integrity of The Interfacial Intermetallic in Sn-Based Solder Joints to Copper Substrates
Kazuhiro Nogita, The University of Queensland

>>Best of Proceedings Paper
>1st Place: Alloy Composition and Thermal Fatigue of High Reliability Pb-Free Solder Alloys
*Richard Coyle, Ph. D., Nokia Bell Labs

>2nd Place: Dissolution Rate of Specific Elements in SAC305 Solder
*David Hillman, Collins Aerospace

>3rd Place: The Influence of Printed Circuit Board Thickness on the Thermal Fatigue of Quad Flat No-Lead Packages
*Richard Coyle, Ph.D., Nokia Bell Labs

>>Best Student Paper
Assessment of 2nd Level Interconnect Quality in Flip Chip Ball Grid Array (FCBGA) Package Using Laser Ultrasonic Inspection Technique
Vishnu Reddy, Georgia Tech

Tuesday September 24, 2019 8:00am - 10:00am CDT
Room 21