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Conference Session [clear filter]
Monday, September 23
 

8:30am CDT

INS1:New Inspection Technologies Towards Industry 4.0
Chair: *Bill Cardoso, Ph.D., Creative Electron
Co-Chair: *Debbie Carboni, KYZEN Corporation

>>How X-Ray Technology is Improving the Electronics Assembly Process
Carlos Valenzuela, Creative Electron, Inc.

>>The Impact of Smart Factory Solutions on PCB Manufacturing
Nicholas Fieldhouse, Omron

>>Smart Inspection Methods in the Electronics Industry
*Ragnar Vaga, YXLON International GmbH

>>Test Methodology for Printed FSR's
Edward Collins, Jabil (MT&I) Manufacturing Technology & Innovation Group

Monday September 23, 2019 8:30am - 9:30am CDT
Room 48

10:30am CDT

INS2: Inspection for Manufacturing Performance Improvement
Chair: *Rob Bougski, Datest Corporation
Co-Chair: *Glen Thomas, Ph.D., Creative Electron, Inc.

>>Micro-Computed Tomography Analysis for Failure Analysis in Electronics
Claire Brennan, Ph.D., Collins Aerospace

>>Improve AOI Performance through Smart Visual Insight Solutions Collaboration
Wayne Zhang, Ph.D., , Ziv Zhao, Ben Wu, Peng Tang,Yan Wang, Marie Cole, Li Qin Shen, Andrew Vogel,
IBM China Procurement Company

>>An Interesting Approach to Yield Improvement
*Keith Bryant, Keith Bryant Consultancy

Monday September 23, 2019 10:30am - 12:00pm CDT
Room 48

1:30pm CDT

INS3: New Techniques to Combat Counterfeit Electronics

Chair: *Terry Kocour,
Co-Chair: Marc Carter

>>Can AI Help Us in the Fight Against Counterfeit Components?
*Glen Thomas, Ph.D., Creative Electron, Inc.

>>Using Standards to Increase Productivity While Fighting Counterfeits
*Cameron Shearon, Raytheon Company

>>Challenges in Detection of Assembly Level Counterfeits
*Diganta Das, Ph.D., CALCE/University of Maryland

Monday September 23, 2019 1:30pm - 3:00pm CDT
Room 48

3:30pm CDT

INS4: Inspection Methods for Long Term Assembly Reliability
Chair: *Keith Bryant, Keith Bryant Consultancy
Co-Chair: *Diganta Das, Ph.D., CALCE/University of Maryland

>>Impact of 10-year Room Temperature Aging on the Temperature Cycle Reliability of SAC105
Deng Yun Chen, Subramani Manoharan, Patrick McClusky, Michael Osterman, CALCE/University of Maryland

>>Microstructure and Mechanical Properties of SAC-Bi Solder Alloys with Aging
*Sa'd Hamasha,Ph.D., Mohamed El Amine Belhadi, Raed Al Athamneh, Auburn University;
Luke Wentlent, Ph.D., Universal Instruments Corporation

Monday September 23, 2019 3:30pm - 5:00pm CDT
Room 48
 
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