SMTA International 2019

Chair: *David Raby, STI Electronics, Inc.
Co-Chair: *Tom Borkes, Jefferson Project

>>pH Neutral Cleaning Agents: Technology and Performance
Terry Price, Ph.D., ZESTRON Americas; Axel Vargas, Lockheed Martin

>>Electrochemical Corrosion Measurements on Metal Alloys Exposed to EAC Cleaning Agents
David Lober, *Mike Bixenman, MBA, DBA, KYZEN Corporation

>>IPC's New Cleanliness Testing Standard is Now Active. What's New? What Stays the Same?
*Mike Konrad, Aqueous Technologies

Chair:
Co-Chair:*Chrys Shea, Shea Engineering Services

>>Vacuum Reflow Processing of Ball Grid Array Packages for Reduced Solder Joint Voiding and Improved Attachment Reliability
*Richard Coyle, Ph.D., Charmaine Johnson, Richard Popowich, Nokia Bell Labs; Tim Pearson, Dave Hillman, Collins Aerospace; Michael Meilunas, Universal Instruments; Fred Dimock, Bob Bouchard, BTU International; Richard Parker, iNEMI; Keith Howell, Nihon Superior Co., Ltd.; *Jörg Trodler, Dipl. -Ing,. Heraeus Electronics; Arvind Karthikeyan, Auburn University; Elizabeth Barr, Iowa State University

>>Effect of Vacuum Reflow on Solder Joint Voiding in Bumped Components
Arvind Srinivasan Karthikeyan, *Sa’d Hamasha, Ph.D., Auburn University; Michael Meilunas, Universal Instruments Corporation; Fred Dimock, BTU International, Inc.

Chair: *Bill Capen, Honeywell
Co-Chair: Adam Murling, Indium Corporation

>>Comparison of Aperture Designs, Solder Pastes, Nanocoatings and Print/Inspection Systems
*Chrys Shea, Jennifer Fijalkowski, Shea Engineering Services; Raymond Whittier, BAE Systems; Michael Butler, Edward Nauss, ITWEAE/MPM; Dean Fiato, StenTech

>>Root Cause Stencil Design for SMT Component Thermal Lands
*Greg Smith, BlueRing Stencils; *Tony Lentz, FCT Assembly

>>Robustness of High Tension, Standard Tension and Mesh Mount Solder Paste Stencils
Prithvi Kotian, Plexus Corp.; Jeff Schake, ASM SMT Solutions; *Martin Anselm, Ph.D., Rochester Institute of Technology

>>Stencil Printing 008004/0201 Aperture Components
Edward Nauss, Michael Butler, ITW EAE

Chair: *Chrys Shea, Shea Engineering Services
Co-Chair:*Ray Whittier, BAE Systems

>>Low Temperature Solder Paste Transfer Efficiency Characterization and Area Ratio Limits
Nilesh Badwe, Ph.D., Abhishek Prasad, Ph.D., Xiying Chen, and Kevin J Byrd, Intel Corporation

>>An Investigation Into the Development of Effective Printing Process for Package on Package (POP) Warpage and Head in Pillow Defect Reduction
Narayanan Manickam, MS, SMTC Corporation

>>Selective Solder Fine Pitch Components on High Thermal Mass Assembly
*Gerjan Diepstraten, Ing., Vitronics Soltec BV

Chair: *Martin Anselm, Ph.D., Rochester Institute of Technology (RIT)
Co-Chair:*Srinivas Chada, Ph.D., Stryker

>>High Density Micro-Dispensing Solder and Adhesives onto FHE and 3D Substrate Assemblies
Sam LeBlanc, nScrypt, Inc.

>>Ultra-Fine Solder Paste Dispensing for Heterogeneous Integration
Kenneth Thum, P.E., Sze Pei Lim, Indium Corporation; KC Tai, NSW Automation Sdn Bhd

>>Aerosol Jet Direct Writing Polymer-Thick-Film Resistors for Printed Electronics
James Feng, Ph.D., Anthony Loveland, Michael J. Renn, Optomec

Chair: *Jason Keeping, P. Eng., Celestica, Inc.
Co-Chair: *Sal Sparacino, ZESTRON USA

>>Characterize and Understand Functional Performance of Cleaning QFN Packages on PCB Assemblies – iNEMI Cleanliness Research Study
*Mike Bixenman, MBA, DBA, KYZEN Corporation

>>Handling Technical Cleanliness in electronic Production
Michael Kövi, *Helmut Schweigart, Ph.D., ZESTRON Corporation

>>Risk Management of Class 3 Electronics as a Function of Cleanliness
*William Capen, Jason Edgar, Honeywell FM&T; *Mark McMeen, *Mike Bixenman, MBA, DBA, Magnalytix LLC