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Popular Events

 

#1

PDC02: Principles and Practice of Developing Soldering Profiles

#2

PDC06: Achieving High Reliability for Lead-Free Solder Joints - Materials Consideration

#3

PDC08: Design and Assembly Process Challenges for Bottom Terminations Components (BTCs) such as QFN, DFN and MLF in Tin-Lead & Lead Free World

#4

HE3: Improving the Reliability of Lead-free Solder Joints

#5

HE4: Progress in Lead-free Solders for Harsh Environment Applications

#6

HE2: Reliability Concerns for Automotive Applications

#7

HE1: Understanding PCBA Ionic Contamination and Corrosive Mitigation Practices for Increased Survivability in Corrosive Environments

#8

INS4: Inspection Methods for Long Term Assembly Reliability

#9

INS1:New Inspection Technologies Towards Industry 4.0

#10

PDC09: Solder Joint Reliability – Principles and Practice

#11

PDC13: Defect Analysis and Process Troubleshooting: Part 2

#12

Women’s Leadership Connection Reception

#13

Women's Leadership Program

#14

PDC12: Defect Analysis and Process Troubleshooting: Part 1

#15

INS2: Inspection for Manufacturing Performance Improvement

#16

Microvia Reliability Lab

#17

INS3: New Techniques to Combat Counterfeit Electronics

#18

PDC14: Design for Excellence: Manufacturing & Reliability Physics

#19

Tuesday Keynote Session and SMTA Annual Meeting

#20

Electronics Exhibition

#21

FSA1: Low Melting Alloys Mixing with SAC Alloys

#22

FSA2: Low Melting Alloy and Reliability

#23

MFX1: Cleaning Technologies

#24

APT2: Package Warpage Implications during Board Assembly

#25

MFX2: Reflow Challenges

#26

SUB1: Surface Finishes

#27

SUB2: Surface Finish Effects

#28

APT1: Advanced Packaging

#29

Wednesday Keynote Session

#30

APT5: Reliability I

#31

Meetings to Greetings Reception

#32

APT3: Solder Joint Voiding

#33

SUB3: Reliability

#34

MFX4: MFX Assembly Challenges

#35

FSA3: Flux Performances

#36

MFX3: Stencils & Printing

#37

FSA4: Reliability Enhancement Through Bonding

#38

APT4: Wafer Level Packaging

#39

SUB5: How It is Made

#40

SUB4: Metallization

#41

LF4: Lead-Free Reliability II

#42

LF1: Lead-Free Reliability I

#43

LF3:Low Temperature Solder

#44

MFX7: Cleaning Challenges

#45

LF2: Microstructure, Structure, Properties

#46

APT7: Reliablity II

#47

MFX6: Conformal Coating

#48

TI1: Smart Factory

#49

TI2: Digital Strategy for Electronics Manufacturing

#50

TI3: Additive Manufacturing in Electronics Panel