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SMTA International 2019
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APT Track
FSA Tack
HE Track
INS Track
MFX Track
Microvia
SUB Track
Exhibition
Lead-Free
All
LF Track
Professional Development Course
Special Event
Technical Innovations Symposium
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Women's Leadership Program
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Sunday
, September 22
Room 50
8:30am •
PDC04: Cost Conscious Test Strategies for Electronic Products
1:30pm •
PDC06: Achieving High Reliability for Lead-Free Solder Joints - Materials Consideration
Room 51
8:30am •
PDC03: Humidity Robustness of Electronics: How to Tackle? * CANCELLED*
1:30pm •
PDC05: Stencil Printing – Advanced Topics
Room 52
8:30am •
PDC02: Principles and Practice of Developing Soldering Profiles
1:30pm •
PDC07: Embedding Passive and Active Components PCB Design, Fabrication Methodologies and Assembly Process Strategy *Cancelled!*
Room 53
8:30am •
PDC01: Design, Fabrication and Assembly Process Principles for Flexible and Rigid Flex Circuits
1:30pm •
PDC08: Design and Assembly Process Challenges for Bottom Terminations Components (BTCs) such as QFN, DFN and MLF in Tin-Lead & Lead Free World
Monday
, September 23
Room 34
1:30pm •
Women's Leadership Program
5:00pm •
Women’s Leadership Connection Reception
Room 45
11:00am •
Microvia Reliability Lab
Room 47/49
8:30am •
HE1: Understanding PCBA Ionic Contamination and Corrosive Mitigation Practices for Increased Survivability in Corrosive Environments
11:00am •
HE2: Reliability Concerns for Automotive Applications
1:30pm •
HE3: Improving the Reliability of Lead-free Solder Joints
3:30pm •
HE4: Progress in Lead-free Solders for Harsh Environment Applications
Room 48
8:30am •
INS1:New Inspection Technologies Towards Industry 4.0
10:30am •
INS2: Inspection for Manufacturing Performance Improvement
1:30pm •
INS3: New Techniques to Combat Counterfeit Electronics
3:30pm •
INS4: Inspection Methods for Long Term Assembly Reliability
Room 50
8:30am •
PDC11: Printing in the Third Dimension; Design, Materials, Equipment & Applications in Electronics
1:30pm •
PDC14: Design for Excellence: Manufacturing & Reliability Physics
Room 51
8:30am •
PDC09: Solder Joint Reliability – Principles and Practice
Room 52
8:30am •
PDC12: Defect Analysis and Process Troubleshooting: Part 1
1:30pm •
PDC13: Defect Analysis and Process Troubleshooting: Part 2
Room 53
8:30am •
PDC10: Solder Paste Qualification Using the SMTA Miniaturization Test Vehicle
1:30pm •
PDC15: Tolerance Mistaken: Impacts of Not Properly Addressing Limitations of Material, Industry Standards and Assembly Process Limitations
Tuesday
, September 24
Expo Show Floor - Hall F
10:00am •
Electronics Exhibition
Room 21
8:00am •
Tuesday Keynote Session and SMTA Annual Meeting
Room 44
11:00am •
MFX1: Cleaning Technologies
2:00pm •
MFX2: Reflow Challenges
Room 45
11:00am •
SUB1: Surface Finishes
2:00pm •
SUB2: Surface Finish Effects
Room 48
11:00am •
APT1: Advanced Packaging
2:00pm •
APT2: Package Warpage Implications during Board Assembly
Room 49
11:00am •
FSA1: Low Melting Alloys Mixing with SAC Alloys
2:00pm •
FSA2: Low Melting Alloy and Reliability
Wednesday
, September 25
Double Tree Lobby
7:00am •
Fun Run
Expo Show Floor - Hall F
3:00pm •
Meetings to Greetings Reception
Room 21
10:00am •
Wednesday Keynote Session
Room 44
8:00am •
MFX3: Stencils & Printing
11:00am •
MFX4: MFX Assembly Challenges
1:30pm •
MFX5: New and Unique Material Deposition
Room 45
8:00am •
SUB3: Reliability
11:00am •
SUB4: Metallization
1:30pm •
SUB5: How It is Made
Room 48
8:00am •
APT3: Solder Joint Voiding
11:00am •
APT4: Wafer Level Packaging
1:30pm •
APT5: Reliability I
Room 49
8:00am •
FSA3: Flux Performances
11:00am •
FSA4: Reliability Enhancement Through Bonding
Thursday
, September 26
Room 44
10:30am •
MFX7: Cleaning Challenges
Room 45
8:00am •
TI1: Smart Factory
10:30am •
TI2: Digital Strategy for Electronics Manufacturing
1:00pm •
TI3: Additive Manufacturing in Electronics Panel
Room 48
8:00am •
APT6:Thermal
10:30am •
APT7: Reliablity II
Room 49
8:00am •
LF1: Lead-Free Reliability I
10:30am •
LF2: Microstructure, Structure, Properties
1:00pm •
LF3:Low Temperature Solder
2:45pm •
LF4: Lead-Free Reliability II
TBA
8:00am •
MFX6: Conformal Coating
Timezone
SMTA International 2019
America/Chicago
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SMTA International 2019
Sep 22
-
26, 2019
Sunday
, September 22
Monday
, September 23
Tuesday
, September 24
Wednesday
, September 25
Thursday
, September 26
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Donald E Stevens Convention Center, Rosemont, IL, USA
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Double Tree Lobby
Expo Show Floor - Hall F
Room 21
Room 34
Room 44
Room 45
Room 47/49
Room 48
Room 49
Room 50
Room 51
Room 52
Room 53
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Professional Development Course
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Karlie Severinson
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Dates
Sunday
, September 22
Monday
, September 23
Tuesday
, September 24
Wednesday
, September 25
Thursday
, September 26
Types
Conference Session
All
APT Track
FSA Tack
HE Track
INS Track
MFX Track
Microvia
SUB Track
Exhibition
Lead-Free
All
LF Track
Professional Development Course
Special Event
Technical Innovations Symposium
All
Ti Track
Women's Leadership Program
All
WLP
Venues
Double Tree Lobby
Expo Show Floor - Hall F
Room 21
Room 34
Room 44
Room 45
Room 47/49
Room 48
Room 49
Room 50
Room 51
Room 52
Room 53
TBA
