SMTA International 2019 has ended

Create Your Own Event

SMTA International 2019

Room 50

8:30am • PDC04: Cost Conscious Test Strategies for Electronic Products
1:30pm • PDC06: Achieving High Reliability for Lead-Free Solder Joints - Materials Consideration

Room 51

Room 52

8:30am • PDC02: Principles and Practice of Developing Soldering Profiles
1:30pm • PDC07: Embedding Passive and Active Components PCB Design, Fabrication Methodologies and Assembly Process Strategy *Cancelled!*

Room 53

8:30am • PDC01: Design, Fabrication and Assembly Process Principles for Flexible and Rigid Flex Circuits
1:30pm • PDC08: Design and Assembly Process Challenges for Bottom Terminations Components (BTCs) such as QFN, DFN and MLF in Tin-Lead & Lead Free World

Room 34

Room 45

11:00am • Microvia Reliability Lab

Room 47/49

Room 48

Room 50

Room 51

8:30am • PDC09: Solder Joint Reliability – Principles and Practice

Room 52

Room 53

Expo Show Floor - Hall F

10:00am • Electronics Exhibition

Room 21

8:00am • Tuesday Keynote Session and SMTA Annual Meeting

Room 44

Room 45

Room 48

Room 49

Double Tree Lobby

7:00am • Fun Run

Expo Show Floor - Hall F

3:00pm • Meetings to Greetings Reception

Room 21

10:00am • Wednesday Keynote Session

Room 44

Room 45

Room 48

Room 49

Room 44

10:30am • MFX7: Cleaning Challenges

Room 45

Room 48

Room 49

TBA

8:00am • MFX6: Conformal Coating